In this guide, I’ll explain how to disassemble Meizu MX4 Pro to remove the back cover, middle frame, battery, rear camera, front camera and motherboard. Refer to this guide, you can repair your MX4 Pro.
First of all, remove the back cover with your fingernails.
Remove ten screws securing the middle frame.
Once the back cover was removed, you can access the internal structure of the Meizu MX4 Pro.
Dual LED flash is integrated on the back cover, there are three sponge on the back cover. It’s used for fixing cables on the motherboard.
The sound chamber on the back cover
Meizu MX4 Pro use the sapphire glass t o protect the camera.
Meizu MX4 Pro comes with a 3.8v, 3350mah Li-polymer battery.
Meizu MX4 Pro uses a magnesium alloy frame, making the phone get better hardness, an d more light.
The soft cable is integrated a vibrator.
Remove four screws securing the little board.
Fingerprint recognition module
The fingerprint recognition module is coming from shenzhen Goodix.
You can see. The whole motherboard was covered by a metal shield. There is a layer of graphite on the metal shield.
5MP front camera and rear camera
Sony 2070-megapixel rear camera
Remove the light proximity sensor module.
Dual noise-canceling microphone
Remove the metal shield. You can see the chips on the motherboard.
The 20nm Samsung Exynos 5430 octa-core processor, its with four Cortex-A15 cores clocked at 1.8 GHz, four Cortex-A7 cores clocked at 1.3 GHz, and the Mali T628MP6 GPU, the Exynos 5430 supports display resolutions of WQHD (2560×1440) and WQXGA (2560×1600).
Broadcom BCM4339 5GHz WiFi + Bro adcom BCM47531 GPS Chips, the Broadcom BCM47531 is also support china Beidou Navigation System.
Samsung S2MPS13 power management chip
Marvell 88RF858 4G LTE transceiver
Skyworks 77753-51 RF chip
Triquint TQP9058H RF chip
Toshiba 8GB MLC chip
NXP TFA9890A audio amplifier
Marvell 88MP1802 baseband chip
NXP 65T08 NFC Chip
ESS ES9018 DAC Chip
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